TMS320F28335PGFA
- 制造商编号：
- TMS320F28335PGFA
- 品牌：
- TI
- 库存数量：
- 4500件
- 售价：
- ¥101.000
- 上架时间：
- 2019/4/23 20:11:27
| 数量 | 价格 |
| 5+ | ¥101.000 |
| 50+ | ¥98.980 |
| 500+ | ¥98.980 |
| 1000+ | ¥98.980 |
| 3000+ | ¥98.980 |
描述
C2000™ 32-bit microcontrollers are optimized for processing, sensing, and actuation to improve closed-loop performance in real-time control applications such asindustrial motor drives; solar inverters and digital power;electrical vehicles and transportation; motor control; andsensing and signal processing. The C2000 line includes the Delfino™ Premium Performance family and thePiccolo™ Entry Performance family.
TMS320C2000™ 32-bit microcontrollers are optimized for processing, sensing, and actuation to improve closed-loop performance in real-time control applications. The C2000™microcontrollers line includes the Delfino™ Premium Performance microcontroller family and the Piccolo™ Entry Performance microcontroller family.
The TMS320F28335, TMS320F28334, TMS320F28333, TMS320F28332, TMS320F28235, TMS320F28234, and TMS320F28232 devices, members of the TMS320C28x/Delfino™ DSC/MCU generation, are highly integrated, high-performance solutions for demanding control applications.
Throughout this document, the devices are abbreviated as F28335, F28334, F28333, F28332, F28235, F28234, and F28232, respectively. F2833x Device Comparison and F2823x Device Comparison provide a summary of features for each device.
To learn more about the C2000 MCUs, visit the C2000 Overview at www.ti.com/c2000.
特性
High-performance static CMOS technology
Up to 150 MHz (6.67-ns cycle time)
1.9-V/1.8-V core, 3.3-V I/O design
High-performance 32-bit CPU (TMS320C28x)
IEEE 754 single-precision Floating-Point Unit (FPU) (F2833x only)
16 × 16 and 32 × 32 MAC operations
16 × 16 dual MAC
Harvard bus architecture
Fast interrupt response and processing
Unified memory programming model
Code-efficient (in C/C++ and Assembly)
Six-channel DMA controller (for ADC, McBSP, ePWM, XINTF, and SARAM)
16-bit or 32-bit External Interface (XINTF)
More than 2M × 16 address reach
On-chip memory
F28335, F28333, F28235:
256K × 16 flash, 34K × 16 SARAMF28334, F28234:
128K × 16 flash, 34K × 16 SARAMF28332, F28232:
64K × 16 flash, 26K × 16 SARAM1K × 16 OTP ROM
Boot ROM (8K × 16)
With software boot modes (through SCI, SPI, CAN, I2C, McBSP, XINTF, and parallel I/O)
Standard math tables
Clock and system control
On-chip oscillator
Watchdog timer module
GPIO0 to GPIO63 pins can be connected to one of the eight external core interrupts
Peripheral Interrupt Expansion (PIE) block that supports all 58 peripheral interrupts
128-bit security key/lock
Protects flash/OTP/RAM blocks
Prevents firmware reverse-engineering
Enhanced control peripherals
Up to 18 PWM outputs
Up to 6 HRPWM outputs with 150-ps MEP resolution
Up to 6 event capture inputs
Up to 2 Quadrature Encoder interfaces
Up to 8 32-bit timers
(6 for eCAPs and 2 for eQEPs)Up to 9 16-bit timers
(6 for ePWMs and 3 XINTCTRs)Three 32-bit CPU timers
Serial port peripherals
Up to 2 CAN modules
Up to 3 SCI (UART) modules
Up to 2 McBSP modules (configurable as SPI)
One SPI module
One Inter-Integrated Circuit (I2C) bus
12-bit ADC, 16 channels
80-ns conversion rate
2 × 8 channel input multiplexer
Two sample-and-hold
Single/simultaneous conversions
Internal or external reference
Up to 88 individually programmable, multiplexed GPIO pins with input filtering
JTAG boundary scan support
IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture
Advanced emulation features
Analysis and breakpoint functions
Real-time debug using hardware
Development support includes
ANSI C/C++ compiler/assembler/linker
Code Composer Studio™ IDE
DSP/BIOS™ and SYS/BIOS
Digital motor control and digital power software libraries
Low-power modes and power savings
IDLE, STANDBY, HALT modes supported
Disable individual peripheral clocks
Endianness: Little endian
Package options:
Lead-free, green packaging
176-ball plastic Ball Grid Array (BGA) (ZJZ)
179-ball MicroStar BGA™ (ZHH)
176-pin Low-Profile Quad Flatpack (LQFP) (PGF)
176-pin Thermally Enhanced Low-Profile Quad Flatpack (HLQFP) (PTP)
Temperature options:
A: –40°C to 85°C (PGF, ZHH, ZJZ)
S: –40°C to 125°C (PTP, ZJZ)
Q: –40°C to 125°C (PTP, ZJZ)
(AEC Q100 qualification for automotive applications)
